日志档案

发表于 2007-8-17 16:06:39

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常用集成电路的封装形式

常用集成电路的封装形式

CLCC


 

DIP
Dual Inline Package



 

DIP-tab
Dual Inline Package with Metal Heatsink

FBGA

FDIP

FTO220

Flat Pack

HSOP28

ITO220

ITO3p

JLCC

LCC

LDCC

LGA

LQFP

PCDIP

PLCC


 

PQFP

PSDIP


LQFP 100L


 

METAL QUAD 100L


 

PQFP 100L


 

QFP
Quad Flat Package

SOT143

SOT220

SOT223

SOT223

SOT23

SOT23/SOT323

SOT25/SOT353

SOT26/SOT363

SOT343

SOT523

SOT89

SOT89

LAMINATE TCSP 20L
Chip Scale Package


 

TO252

TO263/TO268

SO DIMM
Small Outline Dual In-line Memory Module