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发表于 2008-4-27 17:31:49

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标签： allegro  orcad  

orcad allegro教程 连载之七续 封装库下载

初学allegro莫过于找不到下载库，别人做的对自己总是不那么适用。初学时希望能有个参考然后在自己创建新的元器件库。
一个偶然的机会，拾舟找到了一个初学者的allegro封装库学习的好地方:adi的网站。这里包括了常用的pcb设计的所有的库，包括了protel allegro multisim orcad powerpcb 等知名pcb设计软件。
以下均摘自analog.com.

All ADI Models ADI_All_MultiSim_Symbols.zip
(335,294,422 bytes)
ADI_All_Orcad_Symbols.zip
(12,977,959 bytes)
ADI_All_Protel99_Symbols.zip
(5,901,673 bytes)
 ADI_All_Allegro_Footprints.zip
(2,957,641 bytes)
ADI_All_BoardStation_Footprints.zip
(827,695 bytes)
ADI_All_PowerPCB_Footprints.zip
(880,315 bytes)
ADI_All_Protel99PCB_Footprints.zip
(816,472 bytes)
ADI_All_Ultiboard_Footprints.zip
(1,437,017 bytes)



Packages
http://blog.21ic.com/
http://blog.21ic.com/
BGA (Ball Grid Array)
http://blog.21ic.com/ CBGA (Ceramic)
http://blog.21ic.com/ FCBGA
http://blog.21ic.com/ PBGA (Plastic)
http://blog.21ic.com/ SBGA (w/Heatsink)
http://blog.21ic.com/
CSP (Chip Scale Package)
http://blog.21ic.com/ CSP BGA (Ball Grid Array)
http://blog.21ic.com/ LFCSP (LeadFrame)
http://blog.21ic.com/ LGA (Land Grid Array)
http://blog.21ic.com/ Tape CSP BGA
http://blog.21ic.com/ WLCSP (Wafer Level)
http://blog.21ic.com/
DIP (Dual Inline Package)
http://blog.21ic.com/ CerDIP (Ceramic)
http://blog.21ic.com/ CerDIP - Side or Bottom Brazed
http://blog.21ic.com/ CerPAK - Gullwing Leads
http://blog.21ic.com/ Metal or Hybrid DIP
http://blog.21ic.com/ PDIP (Plastic)
http://blog.21ic.com/
FlatPack
http://blog.21ic.com/ Ceramic Flat Package
http://blog.21ic.com/
Header
http://blog.21ic.com/ Modules
http://blog.21ic.com/ TO-92 (Plastic Header)
http://blog.21ic.com/ TO-XX (Metal Header)
http://blog.21ic.com/
LCC (Leaded or Leadless Chip Carrier)
http://blog.21ic.com/ CLCC - Gullwing Leads
http://blog.21ic.com/ J leaded CLCC
http://blog.21ic.com/ LCC (Leadless Ceramic)
http://blog.21ic.com/ LDCC (Leaded Ceramic)
http://blog.21ic.com/ PLCC (Plastic, Leaded)
http://blog.21ic.com/ PLCC w/heat sink
http://blog.21ic.com/
PGA (Pin Grid Array)
http://blog.21ic.com/ Ceramic Pin Grid Array
http://blog.21ic.com/
QFP (Quad Flat Pack)
http://blog.21ic.com/ CQFP (Ceramic)
http://blog.21ic.com/ LQFP 1.4mm thick
http://blog.21ic.com/ LQFP w/heat sink
http://blog.21ic.com/ MQFP
http://blog.21ic.com/ MQFP - Thermally Enhanced
http://blog.21ic.com/ TQFP (Thin, 1.0mm)
http://blog.21ic.com/ TQFP - Thermally Enhanced
http://blog.21ic.com/
SIP (Single Inline Package)
http://blog.21ic.com/ SIP Gullwing Leads
http://blog.21ic.com/ SIP Horizontal Leads
http://blog.21ic.com/ SIP Vertical Leads
http://blog.21ic.com/
SOIC (Small Outline IC)
http://blog.21ic.com/ PSOP (SOIC w/heatslug)
http://blog.21ic.com/ SOIC (Narrow)
http://blog.21ic.com/ SOIC (Wide)
http://blog.21ic.com/
SOP (Small Outline Package)
http://blog.21ic.com/ MSOP (micro-SOIC)
http://blog.21ic.com/ QSOP (25mil pitch)
http://blog.21ic.com/ SSOP (Shrink SO)
http://blog.21ic.com/ Thermally Enhanced [PSOP/2]
http://blog.21ic.com/ TSSOP (Thin, 1.2mm)
http://blog.21ic.com/ TSSOP_EP
http://blog.21ic.com/
SOT (Small Outline Transistor)
http://blog.21ic.com/ SC-70
http://blog.21ic.com/ SOT-143
http://blog.21ic.com/ SOT-223
http://blog.21ic.com/ SOT-23
http://blog.21ic.com/ SOT-66
http://blog.21ic.com/ SOT-89
http://blog.21ic.com/ TSOT-23 (Thin, 0.9mm)

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