标签：
PCB
常见封装术语解释
BGA Ball Grid Array
CerDIP Ceramic Dual-in-Line Package
FBGA FineLine BGA™
PGA Pin Grid Array
HBGA Hybrid FineLine BGA
PLCC Plastic J-Lead Chip Carrier
PDIP Plastic Dual-in-Line Package
PQFP Plastic Quad Flat Pack
RQFP Power Quad Flat Pack
SOIC Small Outline Integrated Circuit
TQFP Thin Quad Flat Pack
UBGA Ultra FineLine BGA
库存封装缩写说明
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